Product Range :
     - PROTOTYPES
 - DOUBLE SIDE
 - MULTILAYERS UPTO 24 LAYERS
 
Product Specifications :
   
SPECIFICATIONS
STANDARAD
PROTOTYPE
 MINIMUM CONDUCTOR  WIDTH  5 MILS/ 0.127 MM  4 MILS/ 0.10 MM
 MINIMUM CONDUCTOR  SPACING  5 MILS/ 0.127 MM  4 MILS/ 0.10 MM
 MINIMUM PLATED HOLE SIZE  10 MILS/ 0.25 MM  8 MILS/ 0.20 MM
 MAXIMUM BOARD  SIZE  (ACTIVE)  610 MM X 400 MM  820 MM X 400 MM
 MAXIMUM NUMBER OF  LAYERS  18  24
 MAXIMUM OUTER LAYER CU.  THICKNESS  4 OZ (140 Micron)  6 OZ (210 Micron)
 MAXIMUM INNER LAYER CU.  THICKNESS  2 OZ (70 Micron)  3 OZ (105 Micron)
 BOARD THICKNESS  TOLERANCE  +10 %  +10 %
 SMD TESTING  20 MILS/ 0.50 MM  15 MILS/ 0.38 MM
   
PTH-NPTH Tolerances
PTH
NPTH
Hole Size
Tol.
Hole Size
Tol.
0.5-3.5 mm
+/-0.10 mm
< 3.0 mm
+/- 0.10 mm
> 3.5 mm
+/-0.15 mm
> 3.0 mm
+/- 0.15 mm
   
PCB SIZE Tolerances
Size
Tol.
< 150 mm
+/-0.20 mm
> 150 mm
+/-0.50 mm
Other Tolerances
Thickness of PCB
+/- 10%
Tolerance for Track width / spacing
+/- 20%
Tolerance for Finished copper thickness (Plating in hole is considered)
> 20 micron
 
Product Finish :
   
1) PROTOTYPES 2) SOLDER MASK FINISH
LEAD FREE FINISHES
 - IMMERSION SILVER
 - ELECTROLESS NICKEL IMMERSION GOLD
 - IMMERSION TIN
 - LEAD FREE HAL
 - PHOTO IMAGEABLE LIQUID    SOLDERMASK
 - SMOBC( GREEN, BLACK, RED,     BLUE)
 - DRY FILM SOLDERMASK
ELECTOROLYTIC GOLD PLATING  
HASL  
CARBON PRINTING  
PEELABLE MASKING  
3) PRODUCT RAW MATERIAL  
 - FR-4,  IS 400,  IS 410
 - RT DUROID ( ROGERS )
 - SPECIAL LAMINATES
 
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